Optimized 5Gbps LAN (Patent Pending)

ASRock's 5Gb/s LAN Connector features exclusive patented design, boasting superior electromagnetic interference resistance, ensuring high-speed stable performance and providing users with a better networking experience.

Exclusive 20K Cap with 1000uF Capacitance

The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, bringing several benefits:

● Higher Capacitance: Greater charge storage for better support under high loads.
● Lower Ripple: Reduced power output fluctuations, improving quality.
● More Stable Output Current: Stable power supply, minimizing voltage impacts.
● Better Performance & System Stability: Increased reliability and consistent performance.

Optimized 5Gbps LAN (Patent Pending)

ASRock's 5Gb/s LAN Connector features exclusive patented design, boasting superior electromagnetic interference resistance, ensuring high-speed stable performance and providing users with a better networking experience.

Exclusive 20K Cap with 1000uF Capacitance

The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, bringing several benefits:

● Higher Capacitance: Greater charge storage for better support under high loads.
● Lower Ripple: Reduced power output fluctuations, improving quality.
● More Stable Output Current: Stable power supply, minimizing voltage impacts.
● Better Performance & System Stability: Increased reliability and consistent performance.

Optimized 5Gbps LAN (Patent Pending)

ASRock's 5Gb/s LAN Connector features exclusive patented design, boasting superior electromagnetic interference resistance, ensuring high-speed stable performance and providing users with a better networking experience.

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High Speed M.2 Solution

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128GB/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

24+2+1 Power Phase Design, 110A SPS

Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.

Server Grade Low Loss PCB

The server grade low loss PCB improves signal integrity, allowing motherboard to support PCIe 5.0 for both graphics card and M.2 SSD, it also improves memory OC potential to deliver the most extreme memory performance.

8 Layer PCB Design +
2oz Copper PCB

The 8 Layer PCB and 2oz copper inner layers provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency, ensures a reliable and long-lasting system while delivering ultimate performance without any compromise.

DDR5 XMP & EXPO Support

Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboards is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel^® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.
* There are certain risks involved with memory overclocking and may affect your system’s stability. Please realize that overclocking should be done at your own risk and expense. EXPO/XMP profile support may vary by different system configuration, memory modules and motherboard models. Please refer to Memory QVL for the completed support list.

High Speed M.2 Solution

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128GB/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

24+2+1 Power Phase Design, 110A SPS

Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.

Server Grade Low Loss PCB

The server grade low loss PCB improves signal integrity, allowing motherboard to support PCIe 5.0 for both graphics card and M.2 SSD, it also improves memory OC potential to deliver the most extreme memory performance.

8 Layer PCB Design +
2oz Copper PCB

The 8 Layer PCB and 2oz copper inner layers provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency, ensures a reliable and long-lasting system while delivering ultimate performance without any compromise.

DDR5 XMP & EXPO Support

Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboards is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel^® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.
* There are certain risks involved with memory overclocking and may affect your system’s stability. Please realize that overclocking should be done at your own risk and expense. EXPO/XMP profile support may vary by different system configuration, memory modules and motherboard models. Please refer to Memory QVL for the completed support list.

High Speed M.2 Solution

The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128GB/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

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Enhanced USB4 Type-C

USB4 technology brings speed and versatility to the most advanced USB Type-C, offering a fast and simple level of connection for work or home. It enables lightning-fast 40Gbps data transfer bitrate.

802.11be Wi-Fi 7

Wi-Fi 7 offers higher data throughput, lower latency, and Multi-link Operation. These features ensure a smooth and real-time interactive experience, making the VR/AR experience more immersive and connected.

Enhanced USB4 Type-C

USB4 technology brings speed and versatility to the most advanced USB Type-C, offering a fast and simple level of connection for work or home. It enables lightning-fast 40Gbps data transfer bitrate.

802.11be Wi-Fi 7

Wi-Fi 7 offers higher data throughput, lower latency, and Multi-link Operation. These features ensure a smooth and real-time interactive experience, making the VR/AR experience more immersive and connected.

Enhanced USB4 Type-C

USB4 technology brings speed and versatility to the most advanced USB Type-C, offering a fast and simple level of connection for work or home. It enables lightning-fast 40Gbps data transfer bitrate.

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Composite VRM Heatsink

It is equipped with a composite VRM heatsink combining a cooling fan, bigger aluminum sink and heat pipe for maximum heat dissipation.

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BIOS Flashback

The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.

Graphics Card EZ Release

ASRock redesigned the PCIe slot installation method to cater to user needs, allowing for hassle-free installation and removal of the graphics card effortlessly.

Models	Graphics Card EZ Release
X870E Taichi	V
X870E Nova WiFi	V

M.2 Heatsink Toolless Design

M.2 Heatsink Toolless Design

Besides the M.2 SSD toolless design on the motherboard, ASRock up a notch by introducing this industry first M.2 heatsink quick release mechanism on the motherboard. The user friendly toolless design helps installing M.2 SSD super easy & simple.

M.2 Bottom Heatsink

M.2 Bottom Heatsink

The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.

BIOS Flashback

The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.

Graphics Card EZ Release

ASRock redesigned the PCIe slot installation method to cater to user needs, allowing for hassle-free installation and removal of the graphics card effortlessly.

Models	Graphics Card EZ Release
X870E Taichi	V
X870E Nova WiFi	V

M.2 Heatsink Toolless Design

M.2 Heatsink Toolless Design

Besides the M.2 SSD toolless design on the motherboard, ASRock up a notch by introducing this industry first M.2 heatsink quick release mechanism on the motherboard. The user friendly toolless design helps installing M.2 SSD super easy & simple.

M.2 Bottom Heatsink

M.2 Bottom Heatsink

The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.

BIOS Flashback

The M.2 bottom heatsink is able to dissipate heat of the M.2 SSD efficiently through the motherboard PCB, maximize performance while maintaining system stability.

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*Features may vary by model.

New X870E/X870 Series Motherboards

X870E Taichi
• EATX
• 24+2+1 Power Phase, 110A SPS for VCore
• 4 x DDR5 DIMMs
• 2 PCIe 5.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  3 Hyper M.2 (PCIe Gen4x4)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  5 USB 3.2 Gen2 Type-A (Rear)
  7 USB 3.2 Gen1 (3 Rear, 4 Front)
• 5Gbps LAN & 802.11be WiFi 7
• EZ Release Design
  Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870E Nova WiFi
• ATX
• 20+2+1 Power Phase, 110A SPS for VCore
• 4 x DDR5 DIMMs
• 1 PCIe 5.0 x16, 1 PCIe 3.0 x16, 1 PCIe 3.0 x1
• 1 Blazing M.2 (PCIe Gen5x4)
  3 Hyper M.2 (PCIe Gen4x4)
  1 M.2 (PCIe Gen3x2 & SATA3)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  5 USB 3.2 Gen2 Type-A (Rear)
  7 USB 3.2 Gen1 (3 Rear, 4 Front)
• 5Gbps LAN & 802.11be WiFi 7
• EZ Release Design
  Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870 Steel Legend WiFi
• ATX
• 14+2+1 Power Phase, 80A Dr.MOS for VCore
• 4 x DDR5 DIMMs
• 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  2 Hyper M.2 (PCIe Gen4x4)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  2 USB 3.2 Gen2 Type-A (Rear)
  7 USB 3.2 Gen1 (3 Rear, 4 Front)
• 2.5Gbps LAN & 802.11be WiFi 7
• Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870E Taichi Lite
• EATX
• 24+2+1 Power Phase, 110A SPS for VCore
• 4 x DDR5 DIMMs
• 2 PCIe 5.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  3 Hyper M.2 (PCIe Gen4x4)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  5 USB 3.2 Gen2 Type-A (Rear)
  7 USB 3.2 Gen1 (3 Rear, 4 Front)
• 5Gbps LAN & 802.11be WiFi 7
• Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870 Riptide WiFi
• ATX
• 14+2+1 Power Phase, 80A Dr.MOS for VCore
• 4 x DDR5 DIMMs
• 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  2 Hyper M.2 (PCIe Gen4x4)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  2 USB 3.2 Gen2 Type-A (Rear)
  7 USB 3.2 Gen1 (3 Rear, 4 Front)
• Killer 2.5Gbps LAN & 802.11be WiFi 7
• Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870 PRO RS WiFi
• ATX
• 14+2+1 Power Phase, 80A Dr.MOS for VCore
• 4 x DDR5 DIMMs
• 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  1 Hyper M.2 (PCIe Gen4x4)
  1 Ultra M.2 (PCIe Gen3x4 & SATA3)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  6 USB 3.2 Gen1 (4 Rear, 2 Front)
  9 USB 2.0 (6 Rear, 3 Front)
• 2.5Gbps LAN & 802.11be WiFi 7
• Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More

X870 PRO RS
• ATX
• 14+2+1 Power Phase, 80A Dr.MOS for VCore
• 4 x DDR5 DIMMs
• 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
• 1 Blazing M.2 (PCIe Gen5x4)
  1 Hyper M.2 (PCIe Gen4x4)
  1 Ultra M.2 (PCIe Gen3x4 & SATA3)
• 2 USB4 Type-C (Rear)
  1 USB 3.2 Gen2x2 Type-C (Front)
  6 USB 3.2 Gen1 (4 Rear, 2 Front)
  9 USB 2.0 (6 Rear, 3 Front)
• 2.5Gbps LAN
• Toolless Multi-Layer M.2 Heatsink
  M.2 Bottom Heatsink
Learn More